雜志介紹

Experimental Mechanics雜志介紹

《Experimental Mechanics》是一本以English為主的未開放獲取國(guó)際優(yōu)秀期刊，中文名稱實(shí)驗(yàn)力學(xué)，本刊主要出版、報(bào)道工程技術(shù)-MATERIALS SCIENCE, CHARACTERIZATION & TESTING領(lǐng)域的研究動(dòng)態(tài)以及在該領(lǐng)域取得的各方面的經(jīng)驗(yàn)和科研成果，介紹該領(lǐng)域有關(guān)本專業(yè)的最新進(jìn)展，探討行業(yè)發(fā)展的思路和方法，以促進(jìn)學(xué)術(shù)信息交流，提高行業(yè)發(fā)展。該刊已被國(guó)際權(quán)威數(shù)據(jù)庫(kù)SCIE收錄，為該領(lǐng)域相關(guān)學(xué)科的發(fā)展起到了良好的推動(dòng)作用，也得到了本專業(yè)人員的廣泛認(rèn)可。該刊最新影響因子為2，最新CiteScore 指數(shù)為4.4。

本刊近期中國(guó)學(xué)者發(fā)表的論文主要有：

• Coherent Gradient Sensing Spatial Carrier Method and its Application for In-Situ Dynamic Deformation Monitoring in Laser Repair Process

  Author: Li, J.; Zhong, Q.; Xie, H.; He, W.

• Dynamic Compressive Test of Saturated Sandstones Under Ambient Sub-Zero Temperature

  Author: Xu, Y.; Yang, Y.; Li, X.; Wu, B.; Yao, W.

• An Improved Method for Accurate Measurement of Material Shrinkage During Photopolymerization

  Author: Wang, K.; Wang, Z. Z.

• Comparison Study of Three Camera Calibration Methods Considering the Calibration Board Quality and 3D Measurement Accuracy

  Author: Liu, Y.; Lv, Z.; Zhang, Q.; Zhao, J.; Fang, Z.; Gao, Z.; Su, Y.

英文介紹

Experimental Mechanics雜志英文介紹

Experimental Mechanics is the official journal of the Society for Experimental Mechanics that publishes papers in all areas of experimentation including its theoretical and computational analysis. The journal covers research in design and implementation of novel or improved experiments to characterize materials, structures and systems. Articles extending the frontiers of experimental mechanics at large and small scales are particularly welcome.

Coverage extends from research in solid and fluids mechanics to fields at the intersection of disciplines including physics, chemistry and biology. Development of new devices and technologies for metrology applications in a wide range of industrial sectors (e.g., manufacturing, high-performance materials, aerospace, information technology, medicine, energy and environmental technologies) is also covered.