雜志介紹

Materials Science In Semiconductor Processing雜志介紹

《Materials Science In Semiconductor Processing》是一本以English為主的未開放獲取國際優(yōu)秀期刊，中文名稱半導體加工中的材料科學，本刊主要出版、報道工程技術(shù)-ENGINEERING, ELECTRICAL & ELECTRONIC領域的研究動態(tài)以及在該領域取得的各方面的經(jīng)驗和科研成果，介紹該領域有關本專業(yè)的最新進展，探討行業(yè)發(fā)展的思路和方法，以促進學術(shù)信息交流，提高行業(yè)發(fā)展。該刊已被國際權(quán)威數(shù)據(jù)庫SCIE收錄，為該領域相關學科的發(fā)展起到了良好的推動作用，也得到了本專業(yè)人員的廣泛認可。該刊最新影響因子為4.2，最新CiteScore 指數(shù)為8。

本刊近期中國學者發(fā)表的論文主要有：

• V2O5 nanobelts via a facile water-assisted strategy boosting electrochromic performance

  Author: Sun, Haohao; Wang, Wenxuan; Fan, Qiongzhen; Qi, Yanyuan; Xiong, Yuli; Jian, Zelang; Chen, Wen

• Ag/Ag3PO4 nanoparticles assembled on sepiolite nanofibers: Enhanced visible-light-driven photocatalysis and the important role of Ag decoration

  Author: Ren, Xiaofei; Hu, Guicong; Guo, Qingbin; Gao, Dengzheng; Wang, Li; Hu, Xiaolong

• Exploring the effect of oxygen environment on the Mo/CdTe/CdSe solar cell substrate configuration

  Author: Yang, Xiutao; Long, Yuchen; Zheng, Yujie; Wang, Jiayi; Zhou, Biao; Xie, Shenghui; Li, Bing; Zhang, Jingquan; Hao, Xia; Karazhanov, Smagul; Zeng, Guanggen; Feng, Lianghuan

• Slag refining at various viscosity conditions for SiC inclusion removal during Si scraps recycling

  Author: Pan, Di; Jiang, Dachuan; Hu, Zhiqiang; Li, Pengting; Tan, Yi; Li, Jin; Li, Jiayan

英文介紹

Materials Science In Semiconductor Processing雜志英文介紹

Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.

Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.

Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.